Principal IC Package Design Engineer - TeraWave

Application close date:

At Blue Origin, we envision millions of people living and working in space for the benefit of Earth. We’re working to develop reusable, safe, and low-cost space vehicles and systems within a culture of safety, collaboration, and inclusion. Join our team of problem solvers as we add new chapters to the history of spaceflight! 

We are seeking a foundational leader for our TeraWave team, spearheading the IC packaging team focused on advanced packaging technologies for mmWave AiPs and complex SoCs. You will be responsible for managing the entire product cycle of package development, from design to production. This team will conduct package-level electromagnetic (EM), signal integrity (SI), and thermal simulations. Your work will contribute to Blue Origin’s mission of enabling millions to live and work in space for the betterment of Earth by integrating technology from various product lines to advance space-based communication.

• Relocation provided
• Travel expected up to 15% of the time
• Interviews will include a technical assessment
• This role is based onsite in San Diego, CA, the Bay Area, CA or Renton, WA. A temporary remote work exception is approved while our Bay Area and San Diego sites are being developed.

• Lead the package engineering team to deliver state-of-the-art packaging solutions for various RF/mmWave, MS, and Digital ASICs.
• Define and manage simulation workflows for package-level signal integrity, EM, and thermal analysis.
• Collaborate with IC designers and the payload group to establish package co-optimization methodologies across antenna, PCB, and die.
• Support the ASIC central engineering team with validation & test board simulations.
• Partner with OSATs to explore technology options and ensure mass production capabilities by streamlining design for manufacturability (DFM) rules for reliability and yield.
• Oversee the package qualification process in collaboration with product and QA teams.

• 12+ years of experience in mass-volume IC package development and production lifecycle.
• Advanced degree (MS/PhD) in Electrical Engineering or a related field.
• Extensive experience with thermal, electromagnetic, and signal integrity simulations at both package and system levels.
• Knowledge of System in Package (SiP), Antenna in Package (AiP), and Multi-Chip Module (MCM) implementations.
• Expertise in 2.5D/3D EM simulators (HFSS, EMX, Momentum, etc.) and package design software (Cadence Allegro APD, etc.)

• Experience with developing PDKs/ADKs in EDA CAD tools (Cadence, Keysight, etc.)
• Prior experience with beamformers & phased array implementation.
• Experience in developing radiation-tolerant/hardened packages.
• Experience mentoring early career engineers.

Compensation Range for:

Don’t meet all desired requirements? Studies have shown that some people are less likely to apply to jobs unless they meet every single desired qualification. At Blue Origin, we are dedicated to building an authentic workplace, so if you’re excited about this role but your past experience doesn’t align perfectly with every desired qualification in the job description, we encourage you to apply anyway. You may be just the right candidate for this or other roles.